Metal CMP and brush cleaner
TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
Awarded to Applied Materials South East Asia Pte Ltd for $4,148,000.
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Amounts and figures
Description
THE OBJECT OF THE PROCUREMENT The procurement concerned the delivery of an automatic metal Chemical Mechanical Polishing (CMP) system with an integrated wafer cleaner for processing and planarization of 200 mm semiconductor wafers. The scope included the fully configured CMP tool, integrated cleaning unit, required accessories, and delivery, installation, and commissioning. Tool was acquired for processing of following applications: 1. Copper and barrier polishing steps for a. Integrated passive components b. CMOS wafers Back-End-of-the-Line (BEOL) and Mid-End-of-the-Line (MEOL) c. Hybrid bonding d. Above structures may include also low K materials which need special cleaning methods 2. Through-silicon via (TSV) a. overburden metallization removal b. Silicon, silicon dioxide and silicon nitride polishing during the TSV back side processing 3. Quantum computing related materials polishing Tool to be acquired needed to be able to deliver industrial level quality & repeatability while allowing flexibility in research and technology organisation environment: polishing is done on both wafers that meet SEMI standards and wafers and wafer stacks with non-standard thicknesses, no…
Award criteria
| Type | Criterion | Weight |
|---|---|---|
| Price | Price | — |
Awards
| Lot | Awarded to | Amount | Date |
|---|---|---|---|
| LOT-0000 | Applied Materials South East Asia Pte Ltd | $4,148,000 | 22 May 2026 |
Official publications
| Medium | Reference | Date |
|---|---|---|
| TED | 784767-2026 | 11 November 2026 |
| OJS | 219/2026 | 11 November 2026 |
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