200 mm wafer coating and developing track tool DUV

Amounts and figures

Description

THE OBJECT OF THE TENDER PROCESS The object of the procurement is 200 mm wafer coating and developing track tool for VTT Micronova cleanroom semiconductor front end processing. The procurement involves a tool integrated into a DUV exposure tool, but also capable of developing wafers from the i-line stepper in the same facility. The tool features open cassette loading stations, spin coating and developing stations and hot and cool plates, and a module for integration with the DUV exposure tool. The tool also should have an option of extracting processed wafers in open cassettes. The coating and developing track tool is intended to support silicon semiconductor front end processing of 200 mm wafers, facilitating exposure by DUV stepper or other exposure tool. To this end, it must be capable of priming wafers with HMDS, coating wafers with DUV resist and with BARC, and developing DUV and i-line types of exposed resist, with the associated heating and cooling arrangements. The technical specification of the object of the tender is described in more detail in this Annex 1 of the invitation to tender. The tendered Tool must comply with all technical properties and functionalities, …

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Official publications

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Frequently asked questions

What is the deadline to bid for this tender?

The submission deadline is 29 December 2025, 10:00. Check the official source, as dates can be modified.

Who is the buyer of this tender?

The contracting authority is TEKNOLOGIAN TUTKIMUSKESKUS VTT OY (European Union).

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