Wafer metrology
Buyer: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Published
- 31 August 2026
- Place of performance
- Espoo, FI1B1
- Procedure
- Open procedure
- Lots
- 1
- Notice number
- 00598555-2026
- Reference
- fd377a60-ed62-4667-9bf7-823fce97b68d
- Official source
- Official source
CPV codes
- 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)
- 38300000Instrumentos de medición
Description
The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process was described in more detail in the invitation to tender documents.
Award criteria
- Price — The evaluation of the tenders is described in section 'Grounds for decision'.
- Quality — The evaluation of the tenders is described in section 'Grounds for decision'.
Awards
| Awarded to | Amount | Date |
|---|---|---|
| FRT GmbH | €464,674 | — |
Official publications
- TED · 00598555-2026 · 31 August 2026
- OJS · 167/2026 · 31 August 2026
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Frequently asked questions
- Who is the buyer of this tender?
- The contracting authority is TEKNOLOGIAN TUTKIMUSKESKUS VTT OY (European Union).
- How can I bid for public tenders in European Union?
- Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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