El Vínculo El Vínculo.
Awarded European Union Supplies

Wafer metrology

Buyer: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Published
31 August 2026
Place of performance
Espoo, FI1B1
Procedure
Open procedure
Lots
1
Notice number
00598555-2026
Reference
fd377a60-ed62-4667-9bf7-823fce97b68d
Official source
Official source

CPV codes

Description

The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process was described in more detail in the invitation to tender documents.

Award criteria

Awards

Awarded toAmountDate
FRT GmbH €464,674

Official publications

Other tenders from TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Frequently asked questions

Who is the buyer of this tender?
The contracting authority is TEKNOLOGIAN TUTKIMUSKESKUS VTT OY (European Union).
How can I bid for public tenders in European Union?
Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
Get alerts for tenders like this
Create a free account and receive new tenders from European Union matching your business, every day.

Start for free

Data collected from official public procurement sources. Amounts as published by the buyer.