Silicon Austria Labs – Chips JU: Magnetic thin film sputtering deposition equipment
Awarded to Canon Europa N.V. for €10,718,844.
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Amounts and figures
Description
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the delivery, installation, commissioning and training of a sputter coating system for the deposition of magnetic thin films for Silicon Austria Labs GmbH.
Award criteria
| Type | Criterion | Weight |
|---|---|---|
| Quality | Delivery and installation time | — |
| Quality | Warranty of functionality period | — |
| Price | Price of the device (delivery, installation, commissioning and training) | — |
Awards
| Lot | Awarded to | Amount | Bids received | Date |
|---|---|---|---|---|
| LOT-2750 | Canon Europa N.V. | €10,718,844 | 2 | 8 April 2026 |
Official publications
| Medium | Reference | Date |
|---|---|---|
| TED | 00310316-2026 | 6 May 2026 |
| OJS | 87/2026 | 6 May 2026 |
Other tenders from Silicon Austria Labs GmbH
See the buyer →- Silicon Austria Labs – Automated Spectroscopic Ellipsometer Published: 16 October 2026
- Silicon Austria Labs – Rapid thermal processing Published: 10 September 2026
- Silicon Austria Labs – Chips JU: Thermal processing [magnetic annealing furnace] Published: 27 August 2026
- Silicon Austria Labs – Upgrades for magnetic thin film sputtering deposition equipment Published: 25 August 2026
- Silicon Austria Labs – Chips JU: In-line metrology tool for thin-film measurements Published: 12 August 2026
- Silicon Austria Labs – Chips JU: Ion Beam Trimming Tool Published: 12 August 2026
- Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging Published: 7 August 2026
- Hybrid Wafer Bonding Published: 6 August 2026
- Silicon Austria Labs – Frame / wafer cleaning unit Published: 6 August 2026
- Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding Published: 5 August 2026
Previous and next from Silicon Austria Labs GmbH
- Silicon Austria Labs – Magnetic Wafer Prober
- Silicon Austria Labs – Chips JU: Wafer bumper
- Silicon Austria Labs – Magnetic thick film sputter tool
- Silicon Austria Labs – Upgrades for magnetic thin film sputtering deposition equipment
- Silicon Austria Labs – Chips JU: Resist processing system
- Silicon Austria Labs – Rapid thermal processing
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Frequently asked questions
- What is the estimated value of this tender?
- The estimated value published by the buyer is €10,718,844.
- Who is the buyer of this tender?
- The contracting authority is Silicon Austria Labs GmbH (European Union).
- How can I bid for public tenders in the European Union?
- Bids are submitted through the official public procurement portal in the European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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