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Awarded European Union Supplies

Hybrid Wafer Bonding

Buyer: Silicon Austria Labs GmbH

Published
6 August 2026
Procedure
Negotiated procedure
Lots
1
Notice number
00546056-2026
Reference
3dd875c3-81d5-4f3e-9e38-8b762df7d082
Official source
Official source

CPV codes

Description

Ziel dieses Vergabeverfahrens ist es, den im Rahmen des Verfahrens zu ermittelnden Bestbieter für die Lieferung, Installation, Inbetriebnahme sowie die Erbringung von Dienstleistungen für ein Hybrid-Wafer-Bonding-System auszuwählen.

Award criteria

Awards

Awarded toAmountDate
EV Group Europe & Asia/Pacific GmbH €2,797,834

Official publications

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The contracting authority is Silicon Austria Labs GmbH (European Union).
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Data collected from official public procurement sources. Amounts as published by the buyer.