Silicon Austria Labs – Chips JU: Wafer bumper
Buyer: Silicon Austria Labs GmbH
- Published
- 3 June 2026
- Estimated value
- €1,260,320
- Procedure
- neg-w-call
- Lots
- 1
- Notice number
- 00378296-2026
- Reference
- 8a1c8fad-c413-4275-8d8d-91259f2d861a
- Official source
- Official source
CPV codes
- 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)
Description
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria Labs GmbH.
Awards
| Awarded to | Amount | Date |
|---|---|---|
| Pac Tech – Packaging Technologies GmbH | €1,260,320 | — |
Frequently asked questions
- What is the estimated value of this tender?
- The estimated value published by the buyer is €1,260,320.
- Who is the buyer of this tender?
- The contracting authority is Silicon Austria Labs GmbH (European Union).
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