Prior Information Notice – Wafer Dicing Equipment
Buyer: Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik
- Published
- 11 June 2026
- Estimated value
- €275,000
- Lots
- 1
- Notice number
- 00401281-2026
- Official source
- Official source
CPV codes
- 42990000Miscellaneous special-purpose machinery
Description
The Ferdinand-Braun-Institut (FBH) plans to procure mechanical wafer dicing equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the separation of semiconductor wafers into individual chips (dicing). It shall support wafers up to 200 mm in diameter and be suitable for various semiconductor materials such as Si, SiC, GaN, InP and GaAs. The equipment is intended to ensure precise and reproducible dicing processes using mechanical blade-based technology. It will be installed in a cleanroom environment and must be compatible with ISO class 7 requirements. The procurement procedure is planned for 2026.
Official publications
- TED · 00401281-2026 · 11 June 2026
- OJS · 111/2026 · 11 June 2026
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Frequently asked questions
- What is the estimated value of this tender?
- The estimated value published by the buyer is €275,000.
- Who is the buyer of this tender?
- The contracting authority is Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik (European Union).
- How can I bid for public tenders in the European Union?
- Bids are submitted through the official public procurement portal in the European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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