Prior Information Notice – Laser Manufacturing System for Wafer Processing
Buyer: Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik
- Published
- 11 June 2026
- Estimated value
- €1,292,000
- Place of performance
- Berlin, DE300
- Lots
- 1
- Notice number
- 00400758-2026
- Official source
- Official source
CPV codes
- 42990000Miscellaneous special-purpose machinery
Description
The Ferdinand-Braun-Institut (FBH) plans to procure a laser-based manufacturing system for advanced wafer processing within the framework of the EU-funded APECS programme. The system will be used for various opto-mechanical processing steps, including wafer dicing, laser ablation of thin layers, via drilling for backside processes, and laser-based decomposition of bonding layers. It shall be capable of processing different semiconductor materials such as SiC, GaN, Si, GaAs and InP for wafer sizes up to 200 mm. The equipment is intended to significantly expand the institute’s capabilities in high-precision wafer processing. It will be installed in a cleanroom environment and must comply with ISO class 5 requirements, including laser protection class 1. The procurement procedure is planned for 2026
Official publications
- TED · 00400758-2026 · 11 June 2026
- OJS · 111/2026 · 11 June 2026
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Frequently asked questions
- What is the estimated value of this tender?
- The estimated value published by the buyer is €1,292,000.
- Who is the buyer of this tender?
- The contracting authority is Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik (European Union).
- How can I bid for public tenders in the European Union?
- Bids are submitted through the official public procurement portal in the European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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