Plasma etch cluster tool
Buyer: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Published
- 15 September 2026
- Procedure
- Negotiated procedure
- Lots
- 1
- Notice number
- 00634728-2026
- Reference
- 6b754d5f-6f8a-48ec-87f0-1c9b06323bba
- Official source
- Official source
CPV codes
- 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)
Description
The object of the procurement is an advanced plasma etch cluster tool to etch metal and thin film layers from 200 mm silicon wafers, as used in the Semiconductor industry. VTT expects a reliable production-worthy tool. The tool should have the capacity for at least four process chambers and other features, which are described below. DIRECT AWARD, Article 40 2(2) of Finnish Procurement act (1397/2016) The procurement will be carried out as a direct award in accordance with 40 article Section 2(2) of the Finnish Public Procurement Act. According to the 40 § section 2(2) of the Act on Public Contracts (1397/2016), only a certain supplier can implement the procurement for a technical reason, or for a reason related to protecting an exclusive right; it shall be a further condition that there are no reasonable alternatives or substitute solutions, and that the absence of competition is not due to an artificial narrowing of the terms and conditions of the procurement. VTT is acquiring an advanced plasma etch cluster tool for the etching of metal, dielectric and other thin-film layers on 200 mm semiconductor wafers. The equipment will support a broad range of research, development and…
Award criteria
- Price — Price
Awards
| Awarded to | Amount | Date |
|---|---|---|
| LAM Research Corporation | — | — |
Official publications
- TED · 00634728-2026 · 15 September 2026
- OJS · 178/2026 · 15 September 2026
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- The contracting authority is TEKNOLOGIAN TUTKIMUSKESKUS VTT OY (European Union).
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