Thermocompression Wafer Molding
Buyer: Silicon Austria Labs GmbH
- Published
- 12 April 2024
- Procedure
- Negotiated procedure
- Lots
- 1
- Documents
- 1
- Notice number
- 00215690-2024
- Reference
- a06379bc-79ae-4ff2-9f02-f5388a74bff1
- Official source
- Official source
CPV codes
- 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)
Description
Ziel der Ausschreibung ist die Anschaffung einer Thermokompressionsformanlage (Thermo-compression molding) für SALs Pilotlinie für Fan-out-Wafer-Level-Packaging.
Award criteria
- Quality — Jurybewertung - Performance
- Quality — Liefer- und Installationszeit
- Quality — Länge der Garantiezeit
- Quality — Garantierte Ersatztteillieferungszeit
- Cost — Preis des Gerätes inkl. Lieferung, Installation, Inbetriebsnahme, Schulung und Wartung für 2 Jahre
- Cost — Service-/Supportkosten: Regiestundensatz Service/Reparatur/Support
- Cost — Service-/Supportkosten: Reisekostenpauschale
Official publications
- TED · 00215690-2024 · 12 April 2024
- OJS · 73/2024 · 12 April 2024
Other tenders from Silicon Austria Labs GmbH
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- Silicon Austria Labs – Chips JU: In-line metrology tool for thin-film measurements
- Silicon Austria Labs – Chips JU: Ion Beam Trimming Tool
- Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
- Altium
- INACO Sputter Deposition tool for LiNbO3
- Wartung - Scanning Electron Microscope
- Silicon Austria Labs – Chips JU: Total Reflection X-Ray Fluorescence Spectrometer (TXRF)
- Silicon Austria Labs – Magnetic Wafer Prober
Frequently asked questions
- Who is the buyer of this tender?
- The contracting authority is Silicon Austria Labs GmbH (European Union).
- How can I bid for public tenders in European Union?
- Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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