TCWM - Thermocompression Wafer Molding
Buyer: Silicon Austria Labs GmbH
- Published
- 20 March 2025
- Place of performance
- Villach, AT211
- Procedure
- Negotiated procedure
- Lots
- 1
- Notice number
- 00182389-2025
- Reference
- abafe74f-f420-4ded-96a3-61c17f3a0321
- Official source
- Official source
CPV codes
- 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)
Description
Ziel der Ausschreibung war die Anschaffung einer Thermokompressionsformanlage (Thermo-compression molding) für SALs Pilotlinie für Fan-out-Wafer-Level-Packaging (https://projekte.ffg.at/projekt/4798640)
Award criteria
- Quality — Jurybewertung (Performance inkl. Support - Gerätebeschreibung und Präsentation)
- Quality — Liefer- und Installationszeit
- Quality — Länge der Garantiezeit
- Quality — Garantierte Ersatzteillieferungszeit
- Price — Preis des Thermocompression Wafer Molding Gerätes inkl. Lieferung, Installation, Inbetriebnahme, Schulung sowie Wartung für 2 Jahre
- Price — Service- / Supportkosten (Regiestundensatz Service/Reparatur/ Support)
- Price — Service- / Supportkosten (Reisekostenpauschale)
Awards
| Awarded to | Amount | Date |
|---|---|---|
| APIC YAMADA CORPORATION | €750,150 | — |
Official publications
- TED · 00182389-2025 · 20 March 2025
- OJS · 56/2025 · 20 March 2025
Other tenders from Silicon Austria Labs GmbH
- Silicon Austria Labs – Chips JU: Thermal processing [magnetic annealing furnace]
- Silicon Austria Labs – Upgrades for magnetic thin film sputtering deposition equipment
- Silicon Austria Labs – Chips JU: In-line metrology tool for thin-film measurements
- Silicon Austria Labs – Chips JU: Ion Beam Trimming Tool
- Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
- Hybrid Wafer Bonding
- Silicon Austria Labs – Frame / wafer cleaning unit
- Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding
- High Tech Campus Villach–Rahmenvereinbarung Reinigungsleistungen
- Altium
Frequently asked questions
- Who is the buyer of this tender?
- The contracting authority is Silicon Austria Labs GmbH (European Union).
- How can I bid for public tenders in European Union?
- Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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