TCWM - Thermocompression Wafer Molding
Awarded to APIC YAMADA CORPORATION for €750,150.
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Amounts and figures
1
Lots
Description
Ziel der Ausschreibung war die Anschaffung einer Thermokompressionsformanlage (Thermo-compression molding) für SALs Pilotlinie für Fan-out-Wafer-Level-Packaging (https://projekte.ffg.at/projekt/4798640)
Award criteria
| Type | Criterion | Weight |
|---|---|---|
| Quality | Jurybewertung (Performance inkl. Support - Gerätebeschreibung und Präsentation) | — |
| Quality | Liefer- und Installationszeit | — |
| Quality | Länge der Garantiezeit | — |
| Quality | Garantierte Ersatzteillieferungszeit | — |
| Price | Preis des Thermocompression Wafer Molding Gerätes inkl. Lieferung, Installation, Inbetriebnahme, Schulung sowie Wartung für 2 Jahre | — |
| Price | Service- / Supportkosten (Regiestundensatz Service/Reparatur/ Support) | — |
| Price | Service- / Supportkosten (Reisekostenpauschale) | — |
Awards
| Lot | Awarded to | Amount | Date |
|---|---|---|---|
| LOT-4205 | APIC YAMADA CORPORATION | €750,150 | 18 February 2025 |
Official publications
| Medium | Reference | Date |
|---|---|---|
| TED | 00182389-2025 | 20 March 2025 |
| OJS | 56/2025 | 20 March 2025 |
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