Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)
Closed.
Interested in tenders like this? Get the next tenders like this one published in the European Union by email. Free, no card needed.
Amounts and figures
Description
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of two module chambers capable of high-power impulse magnetron sputtering and inductively coupled plasma surface preparation intended for the fabrication of various metal thin films, for Silicon Austria Labs GmbH.
Award criteria
| Type | Criterion | Weight |
|---|---|---|
| Quality | Delivery and installation time | — |
| Quality | Commitment to target requirements | — |
| Quality | Warranty of functionality period | — |
| Price | Price of the HiPIMS & ICP modules equipment (delivery, installation, commissioning and training) | — |
Performance conditions
- See procurement documents.
Official publications
| Medium | Reference | Date |
|---|---|---|
| TED | 00421478-2025 | 30 June 2025 |
| OJS | 122/2025 | 30 June 2025 |
Other tenders from Silicon Austria Labs GmbH
See the buyer →- Silicon Austria Labs – Automated Spectroscopic Ellipsometer Published: 16 October 2026
- Silicon Austria Labs – Rapid thermal processing Published: 10 September 2026
- Silicon Austria Labs – Chips JU: Thermal processing [magnetic annealing furnace] Published: 27 August 2026
- Silicon Austria Labs – Upgrades for magnetic thin film sputtering deposition equipment Published: 25 August 2026
- Silicon Austria Labs – Chips JU: In-line metrology tool for thin-film measurements Published: 12 August 2026
- Silicon Austria Labs – Chips JU: Ion Beam Trimming Tool Published: 12 August 2026
- Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging Published: 7 August 2026
- Hybrid Wafer Bonding Published: 6 August 2026
- Silicon Austria Labs – Frame / wafer cleaning unit Published: 6 August 2026
- Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding Published: 5 August 2026
Previous and next from Silicon Austria Labs GmbH
- Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)
- Silicon Austria Labs – ECD – Electrochemical Deposition
- Silicon Austria Labs – Chips JU: Wafer bumper & reflow
- Silicon Austria Labs – Chips JU: Nitride Cluster Tool
- Silicon Austria Labs – Chips JU: Plasma enhanced atomic layer deposition (PE-ALD)
- Silicon Austria Labs – Chips JU: Critical Dimension Scanning Electron Microscope [CD-SEM]
Similar open tenders
- ICP-MS System „Mein Gesundheitszentrum Graz“
- 3D-FRET Mikroskop
- 3D-FRET Mikroskop
- POCT-Systeme zur Messung der Blutzucker-Konzentration für die OÖG und KUK
- Next Generation Sequencing - NGS Geraete
- Vollautomatisches Automated Liquid Handling System (Pipettierroboter) zur Aliquotierung von Studienproben für…
Frequently asked questions
- Who is the buyer of this tender?
- The contracting authority is Silicon Austria Labs GmbH (European Union).
- How can I bid for public tenders in the European Union?
- Bids are submitted through the official public procurement portal in the European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
How can I find out about similar tenders when they are published?
Create an account at el-vinculo.com and we give you a free month and set up your company's filters — contract type, CPV codes, value and territory — so you are the first to know when new tenders like this one come out in the European Union. We email you as soon as one matching your profile is published, with the whole deadline ahead to prepare the bid.
Create a free account and receive new public tenders published in the European Union that match your business, every day.