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Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)

Buyer: Silicon Austria Labs GmbH

Published
30 June 2025
Place of performance
Villach, AT211
Procedure
Negotiated procedure
Lots
1
Documents
1
Notice number
00421478-2025
Reference
f2cdc95c-9965-403e-8ebf-215e2f4cac77
Official source
Official source

CPV codes

Description

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of two module chambers capable of high-power impulse magnetron sputtering and inductively coupled plasma surface preparation intended for the fabrication of various metal thin films, for Silicon Austria Labs GmbH.

Award criteria

Official publications

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The contracting authority is Silicon Austria Labs GmbH (European Union).
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Data collected from official public procurement sources. Amounts as published by the buyer.