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Awarded European Union Supplies

LA2972C- UCC- RFT for the Supply of a High Aspect Ratio Etcher

Buyer: Education Procurement Service (EPS)

Published
25 September 2025
Estimated value
€900,000
Place of performance
IE051
Procedure
Open procedure
Lots
1
Notice number
00628309-2025
Reference
20db0c4c-52e5-43ce-9b97-a54813b53ee1
Official source
Official source

CPV codes

Description

Tenders are sought for the supply delivery, installation and commissioning of a High Aspect Ratio Etcher for University College Cork. The new etcher will enhance the capabilities at the Tyndall National Institute for the advanced heterogeneous of semiconductor devices. We invite proposals for an advanced etching system capable of performing high aspect ratio silicon (Si) etching using the Bosch process. This equipment will be essential for etching deep Si trenches, facilitating the creation of through silicon vias (TSVs) that are critical for heterogeneous integration. The ideal tool will offer precision, reliability, and efficiency to meet the requirements for the etching of both 100mm and 200mm wafers. Vendors with cutting-edge solutions that can achieve these high standards are encouraged to submit their proposals for this vital component in our technological advancement.

Award criteria

Awards

Awarded toAmountDate
KLA Corporation €900,000

Official publications

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Frequently asked questions

What is the estimated value of this tender?
The estimated value published by the buyer is €900,000.
Who is the buyer of this tender?
The contracting authority is Education Procurement Service (EPS) (European Union).
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Data collected from official public procurement sources. Amounts as published by the buyer.