Fully Automated Sub-Micron Die Bonder
Awarded to ASMPT Amicra GmbH for €749,900.
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Amounts and figures
1
Lots
Description
Ziel der Ausschreibung ist der Zukauf eines Fully Automated Sub-Micron die Bonders, um hochpräzises Flip Chip Die Bonding mit Sub-Micron Platzierungsgenauigkeit für Substrate bis zu 300 mm zu ermöglichen
Award criteria
| Type | Criterion | Weight |
|---|---|---|
| Quality | Jurybewertung - Performance | — |
| Quality | Liefer- und Installationszeit | — |
| Quality | Länge der Garantiezeit | — |
| Quality | Garantierte Ersatztteillieferungszeit (Jahre) | — |
| Quality | Zeit zwischen Fehlermeldung und durchgeführter Reparatur | — |
| Quality | Maximaldauer einer Ersatzteillieferung | — |
| Price | Preis des Gerätes inkl. Lieferung, Installation, Inbetriebsnahme, Schulung | — |
| Price | Service/Supportkosten: Wartung jährliche Kosten | — |
| Price | Service-/Supportkosten: Regiestundensatz Service/Reparatur/Support | — |
Awards
| Lot | Awarded to | Amount | Date |
|---|---|---|---|
| LOT-5724 | ASMPT Amicra GmbH | €749,900 | 1 August 2024 |
Official publications
| Medium | Reference | Date |
|---|---|---|
| TED | 00481860-2024 | 9 August 2024 |
| OJS | 155/2024 | 9 August 2024 |
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- The contracting authority is Silicon Austria Labs GmbH (European Union).
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