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Closed European Union Supplies

Fully Automated Sub-Micron Die Bonder

Buyer: Silicon Austria Labs GmbH

Published
24 November 2023
Place of performance
Villach, AT211
Procedure
Negotiated procedure
Lots
1
Documents
1
Notice number
00716438-2023
Reference
0a2e9e8b-aaaf-4931-aff4-888c1d421422
Official source
Official source

CPV codes

Description

Ziel der Ausschreibung ist der Zukauf eines Fully Automated Sub-Micron die Bonders, um hochpräzises Flip Chip Die Bonding mit Sub-Micron Platzierungsgenauigkeit für Substrate bis zu 300 mm zu ermöglichen

Award criteria

Official publications

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The contracting authority is Silicon Austria Labs GmbH (European Union).
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Data collected from official public procurement sources. Amounts as published by the buyer.