Supply, Delivery and Installation of wafer dicing kit for NMIS
Buyer: University of Strathclyde
- Published
- 16 January 2025
- Estimated value
- £305,414
- Place of performance
- UKM82
- Procedure
- Open procedure
- Lots
- 1
- Notice number
- 001435-2025
- Reference
- ocds-h6vhtk-047100
- Official source
- Official source
CPV codes
- 31712330Semiconductors
Description
The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.
Awards
| Awarded to | Amount | Date |
|---|---|---|
| S3 Alliance Ltd | — | — |
Official publications
- FTS · 001435-2025 · 16 January 2025
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Frequently asked questions
- What is the estimated value of this tender?
- The estimated value published by the buyer is £305,414.
- Who is the buyer of this tender?
- The contracting authority is University of Strathclyde (United Kingdom).
- How can I bid for public tenders in the United Kingdom?
- Bids are submitted through the official public procurement portal in the United Kingdom. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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