Supply and Delivery of Swept Laser Source for PIC Measurements 1550nm
Reference ocds-r6ebe6-0000839470 · NHS Lanarkshire
Closed. Submission deadline: 25 August 2026.
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Amounts and figures
Description
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Swept Laser Source for PIC Measurements 1550nm.
Official publications
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Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 25 August 2026, 13:00. Check the official source, as dates can be modified.
- Who is the buyer of this tender?
- The contracting authority is NHS Lanarkshire (United Kingdom).
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