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Awarded European Union Supplies

Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC

University College Cork

Awarded to Logitech. Estimated value: €81,000.

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Amounts and figures

€81,000
Estimated value
1
Lots

Description

Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall’s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation beings with device design and fabrication where sub-micron technologies are now industry standard, and the development of nanoscale processes is progressing rapidly. The challenges of miniaturisation extend onwards to the back-end processes where the removal of unused bulk semiconductor material through precision lapping and polishing is essential to minimising the size of a final device. Tyndall now wishes to enhance its back-end processing capability through the procurement of a high-precision wafer lapping and polishing system for use with silicon, III-V and other semiconductor materials.

Award criteria

TypeCriterionWeight
QualityTechnical Merit—
QualityQuality and Health and Safety—
QualityAfter Sales Technical Support, Warranty and Training—
QualityDelivery Plan—
QualitySustainability—
CostUltimate Cost (Total Cost of Ownership) Including—

Awards

LotAwarded toAmountDate
LOT-0001 Logitech — 15 July 2024

Official publications

MediumReferenceDate
TED 00589516-2024 1 October 2024
OJS 191/2024 1 October 2024

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Frequently asked questions

What is the estimated value of this tender?
The estimated value published by the buyer is €81,000.
Who is the buyer of this tender?
The contracting authority is University College Cork (European Union).
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Data collected from official public procurement sources. Amounts as published by the buyer.