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Awarded European Union Supplies

Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC

Buyer: University College Cork

Published
1 October 2024
Estimated value
€81,000
Place of performance
IE061
Procedure
Open procedure
Lots
1
Notice number
00589516-2024
Reference
09213d57-e477-4a8d-b302-8bf7564906af
Official source
Official source

CPV codes

Description

Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall’s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation beings with device design and fabrication where sub-micron technologies are now industry standard, and the development of nanoscale processes is progressing rapidly. The challenges of miniaturisation extend onwards to the back-end processes where the removal of unused bulk semiconductor material through precision lapping and polishing is essential to minimising the size of a final device. Tyndall now wishes to enhance its back-end processing capability through the procurement of a high-precision wafer lapping and polishing system for use with silicon, III-V and other semiconductor materials.

Award criteria

Awards

Awarded toAmountDate
Logitech

Official publications

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Frequently asked questions

What is the estimated value of this tender?
The estimated value published by the buyer is €81,000.
Who is the buyer of this tender?
The contracting authority is University College Cork (European Union).
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Data collected from official public procurement sources. Amounts as published by the buyer.