Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC
Closed. Submission deadline: 25 June 2024. Estimated value: €81,000.
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Amounts and figures
Description
Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall’s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation beings with device design and fabrication where sub-micron technologies are now industry standard, and the development of nanoscale processes is progressing rapidly. The challenges of miniaturisation extend onwards to the back-end processes where the removal of unused bulk semiconductor material through precision lapping and polishing is essential to minimising the size of a final device. Tyndall now wishes to enhance its back-end processing capability through the procurement of a high-precision wafer lapping and polishing system for use with silicon, III-V and other semiconductor materials.
Official publications
| Medium | Reference | Date |
|---|---|---|
| TED | 00307081-2024 | 24 May 2024 |
| OJS | 100/2024 | 24 May 2024 |
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Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 25 June 2024, 14:00. Check the official source, as dates can be modified.
- What is the estimated value of this tender?
- The estimated value published by the buyer is €81,000.
- Who is the buyer of this tender?
- The contracting authority is University College Cork (European Union).
- How can I bid for public tenders in the European Union?
- Bids are submitted through the official public procurement portal in the European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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