Single wafer plasma asher tool
Buyer: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Published
- 16 January 2025
- Submission deadline
- 23 January 2025, 14:00
- Procedure
- Open procedure
- Lots
- 1
- Documents
- 1
- Notice number
- 00032534-2025
- Reference
- e3b75c26-414c-4ab1-8ba9-e0c90ea707cc
- Official source
- Official source
CPV codes
- 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)
Description
The object of the tender process is Single wafer plasma asher tool (later also “Equipment”). The procurement object is a new 200 mm Single Wafer Plasma asher tool for the VTT Micronova cleanroom semiconductor front end. The procurement includes a process chamber for Polymer Removal and PR ash. The single-wafer plasma asher tool is for silicon semiconductor front-end, the tool must be compatible with industry-standard cleanroom requirements, including automated wafer handling, welded gas lines with VCR-gasket construction, particle filters, etc., and CE-compliant, with Emergency shutdown, capable processing of 200 mm including the following processes: Polymer removal PR ash (bulk strip, HDIS, Descums) The Single wafer asher tool will be used in silicon photonics devices, quantum devices, radiation detectors, and MEMS devices, which are the main product lines in the research fab. The object of the tender process is described in more detail in the invitation to tender documents.
Award criteria
- Price — The criteria on the basis of which tenders are to be compared include the following: PRICE, weighting 100 % The price on the basis of which tenders will be compared against each other is the…
Official publications
- TED · 00032534-2025 · 16 January 2025
- OJS · 11/2025 · 16 January 2025
Other tenders from TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Yritys-, omistaja- ja compliance-tietopalvelukokonaisuuden kokonaishankinta
- Wafer metrology
- VMware lisenssien ja Red Hat tukitilausten hankinta
- Projekti 143092 LTCC PATCH7 materials / LTCC-materiaalit
- Picosecond ultrasonics film thickness measurement tool
- Fyysisen pääsynhallinnan järjestelmien huolto- ja ylläpitopalvelut sekä asennus- ja toimituspalvelut
- Julkisten hankintojen kilpailuttamispalvelut (DPS) 2026–2030
- Tutkimuksen kemikaalit: laboratoriokemikaalit ja teollisuuskemikaalit
- 200 mm wafer coating and developing track tool DUV
- UAS Primary Radar
Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 23 January 2025, 14:00. Check the official source, as dates can be modified.
- Who is the buyer of this tender?
- The contracting authority is TEKNOLOGIAN TUTKIMUSKESKUS VTT OY (European Union).
- How can I bid for public tenders in European Union?
- Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
Create a free account and receive new tenders from European Union matching your business, every day.