Semi-Automatic Wafer Grinder
Buyer: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Published
- 20 October 2025
- Submission deadline
- 17 November 2025, 07:00
- Place of performance
- Esp, FI1B1
- Procedure
- Open procedure
- Lots
- 1
- Documents
- 1
- Notice number
- 00689551-2025
- Reference
- dde3f9e2-2ac9-4d69-a9f6-951468ab0463
- Official source
- Official source
CPV codes
- 42900000Máquinas diversas para usos generales y especiales
Description
The object of the tender is a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment must be new. The tool must comply with cleanroom equipment standard safety and contamination requirements. The object of the tender process is described in more detail in the invitation to tender documents.
Award criteria
- Price — The evaluation of the tenders is described in section 'Grounds for decision'.
Official publications
- TED · 00689551-2025 · 20 October 2025
- OJS · 201/2025 · 20 October 2025
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Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 17 November 2025, 07:00. Check the official source, as dates can be modified.
- Who is the buyer of this tender?
- The contracting authority is TEKNOLOGIAN TUTKIMUSKESKUS VTT OY (European Union).
- How can I bid for public tenders in European Union?
- Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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