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Closed European Union Supplies

Semi-Automatic Wafer Grinder

Buyer: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Published
20 October 2025
Submission deadline
17 November 2025, 07:00
Place of performance
Esp, FI1B1
Procedure
Open procedure
Lots
1
Documents
1
Notice number
00689551-2025
Reference
dde3f9e2-2ac9-4d69-a9f6-951468ab0463
Official source
Official source

CPV codes

Description

The object of the tender is a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment must be new. The tool must comply with cleanroom equipment standard safety and contamination requirements. The object of the tender process is described in more detail in the invitation to tender documents.

Award criteria

Official publications

Other tenders from TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Frequently asked questions

What is the deadline to bid for this tender?
The submission deadline is 17 November 2025, 07:00. Check the official source, as dates can be modified.
Who is the buyer of this tender?
The contracting authority is TEKNOLOGIAN TUTKIMUSKESKUS VTT OY (European Union).
How can I bid for public tenders in European Union?
Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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Data collected from official public procurement sources. Amounts as published by the buyer.