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Closed European Union SuppliesFramework agreement

Rahmenvereinbarung für gehostete Chipdesign-Plattform mit Chipherstellung für das Barkhausen Institut gGmbH

Buyer: Barkhausen Institut gGmbH

Open in El Vínculo
Published
5 June 2025
Submission deadline
7 July 2025, 13:30
Place of performance
Dresden, DED21
Procedure
Open procedure
Lots
1
Documents
1
Notice number
00364671-2025
Reference
01973072-e484-4bd0-8500-c1cc1c93298b
Official source
Official source

CPV codes

Description

Rahmenvereinbarung für gehostete Chipdesign-Plattform mit Chipherstellung für das Barkhausen Institut gGmbH

Award criteria

Official publications

Other tenders from Barkhausen Institut gGmbH

Frequently asked questions

What is the deadline to bid for this tender?
The submission deadline is 7 July 2025, 13:30. Check the official source, as dates can be modified.
Who is the buyer of this tender?
The contracting authority is Barkhausen Institut gGmbH (European Union).
How can I bid for public tenders in European Union?
Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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Data collected from official public procurement sources. Amounts as published by the buyer.