LA2977C- UCC- RFT for the Supply of a High Precision Wafer Grinding System

Published

2 September 2024

Submission deadline

30 September 2024, 12:00

Estimated value

€240,000

Procedure

Open procedure

Lots

1

Documents

1

Notice number

00523309-2024

Reference

ebc612e2-4535-4332-9b2f-d002a60417e0

Official source

Official source

CPV codes

• 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)

Description

University College Cork request the supply of a High Precision Wafer Grinding System. The planned system will be capable of handling wafers of up to 200mm (8-inches) in diameter and will be capable of processing wide variety of materials (silicon, compound semiconductors, glass, ceramics, sapphire, etc.). The desired system will be fully automatic and will carry out the wafer grinder operation in an enclosed chamber. It is envisaged that it will be a single-spindle system suited to research-scale and prototyping volumes.

Official publications

• TED · 00523309-2024 · 2 September 2024
• OJS · 170/2024 · 2 September 2024

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Frequently asked questions

What is the deadline to bid for this tender?

The submission deadline is 30 September 2024, 12:00. Check the official source, as dates can be modified.

What is the estimated value of this tender?

The estimated value published by the buyer is €240,000.

Who is the buyer of this tender?

The contracting authority is Education Procurement Service (EPS) (European Union).

How can I bid for public tenders in European Union?

Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.