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Awarded European Union Supplies

LA2974C- UCC- RFT for the Supply, Delivery and Installation of a Wafer Surface Planarisation System

Buyer: Education Procurement Service (EPS)

Published
11 April 2025
Estimated value
€260,000
Procedure
Open procedure
Lots
1
Notice number
00236584-2025
Reference
fe322881-4ba1-4698-bacc-38846c656cbc
Official source
Official source

CPV codes

Description

University College Cork request the supply of a Wafer Surface Planarisation System for use with semiconductor materials in wafer format. The required system will be used to level, planarise, the surface of a wafer following processing where complex layers and 3D structures have been built up. The system will be required to reduce surface height variation and surface roughness over a large area, i.e. a full wafer. The system will be required to process as wide a range of materials as possible, particularly metals and polymers, and must be suited for use with wafer sizes of up to 200mm, 8 inches, in diameter.

Award criteria

Awards

Awarded toAmountDate
DISCO HI-TEC EUROPE €255,000

Official publications

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Frequently asked questions

What is the estimated value of this tender?
The estimated value published by the buyer is €260,000.
Who is the buyer of this tender?
The contracting authority is Education Procurement Service (EPS) (European Union).
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Data collected from official public procurement sources. Amounts as published by the buyer.