LA2974C- UCC- RFT for the Supply, Delivery and Installation of a Wafer Surface Planarisation System
- Published
- 22 August 2024
- Submission deadline
- 23 September 2024, 12:00
- Estimated value
- €260,000
- Place of performance
- IE042
- Procedure
- Open procedure
- Lots
- 1
- Documents
- 1
- Notice number
- 00505358-2024
- Reference
- fe322881-4ba1-4698-bacc-38846c656cbc
- Official source
- Official source
CPV codes
- 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)
Description
University College Cork request the supply of a Wafer Surface Planarisation System for use with semiconductor materials in wafer format. The required system will be used to level, planarise, the surface of a wafer following processing where complex layers and 3D structures have been built up. The system will be required to reduce surface height variation and surface roughness over a large area, i.e. a full wafer. The system will be required to process as wide a range of materials as possible, particularly metals and polymers, and must be suited for use with wafer sizes of up to 200mm, 8 inches, in diameter.
Official publications
- TED · 00505358-2024 · 22 August 2024
- OJS · 163/2024 · 22 August 2024
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Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 23 September 2024, 12:00. Check the official source, as dates can be modified.
- What is the estimated value of this tender?
- The estimated value published by the buyer is €260,000.
- Who is the buyer of this tender?
- The contracting authority is Education Procurement Service (EPS) (European Union).
- How can I bid for public tenders in European Union?
- Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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