Flip-chip bonder
Buyer: Tampereen korkeakoulusäätiö Sr
- Published
- 27 August 2024
- Submission deadline
- 30 September 2024, 09:00
- Place of performance
- FI197
- Procedure
- Open procedure
- Lots
- 1
- Documents
- 1
- Notice number
- 00512286-2024
- Reference
- 9ecc4e5b-7b81-4b6b-bb13-7cc160e8f69f
- Official source
- Official source
CPV codes
- 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)
Description
Tampere University Foundation sr ('TAU') is inviting tenders for 'Flip-chip bonder'. A die bonder for mounting optoelectronic components epilayer structure down on substrates having pre-deposited Indium or eutectic (Gold-rich) AuSn solder. System must have at least passive alignment tools (i.e., the system does not need to utilize the light emitting or absorbing property of the components in the component alignment stage). System should based on an open platform in hardware and software level to enable TAU to further develop new processes. Moreover, system should enable to use it in a manual operation mode as well as automating a part or the complete process flow.
Award criteria
- Price — Cost of the system (phase 1/2)
- Quality — Performance and optional features (phase 1/2)
- Quality — Support model and Customer references (phase 1/2)
- Quality — Performance in demos (phase 2/2)
Official publications
- TED · 00512286-2024 · 27 August 2024
- OJS · 166/2024 · 27 August 2024
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Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 30 September 2024, 09:00. Check the official source, as dates can be modified.
- Who is the buyer of this tender?
- The contracting authority is Tampereen korkeakoulusäätiö Sr (European Union).
- How can I bid for public tenders in European Union?
- Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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