Deep Reaction Ion Etcher (DRIE)
Open until 17 November 2026.
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Amounts and figures
Description
Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning.
Modifications
- Deadline for receipt of tenders has been modified
Official publications
| Medium | Reference | Date |
|---|---|---|
| TED | 763694-2026 | 3 November 2026 |
| OJS | 213/2026 | 3 November 2026 |
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Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 17 November 2026, 00:00. Check the official source, as dates can be modified.
- Who is the buyer of this tender?
- The contracting authority is Uppsala universitet (European Union).
- How can I bid for public tenders in the European Union?
- Bids are submitted through the official public procurement portal in the European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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