Conformal sputtering tool for versatile deposition of thin films with high aspect ratio, dielectrics and piezoelectrics, advanced metal alloys, and multilayer stacks
Buyer: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Published
- 6 November 2025
- Procedure
- Negotiated procedure
- Lots
- 1
- Notice number
- 00737636-2025
- Reference
- 7e0f9254-6802-4208-a44f-bf77dddcd012
- Official source
- Official source
CPV codes
- 38500000Aparatos de control y prueba
Description
THE SUBJECT OF THE PROCUREMENT The subject of the procurement is a modular and versatile cluster sputtering tool for the deposition of conformal thin films with high aspect ratios. Beside the two conformal sputtering modules, the system is equipped with additional magnetron sputtering and co-sputtering sources for in situ multilayer thin-film deposition of metals, alloys, dielectrics as well as piezoelectrics. DIRECT AWARD, Article 40 2(2) of Finnish Procurement act (1397/2016) The procurement will be carried out as a direct award in accordance with 40 article Section 2(2) of the Finnish Public Procurement Act. Only a certain supplier can implement the procurement for a technical reason, and there are no reasonable alternatives or substitute solutions. The absence of competition is not due to an artificial narrowing of the terms and conditions of the procurement. TECHNICAL REASONS A high-performance 200-mm wafer sputtering cluster tool is required, which is able to deposit conformal thin films with high aspect ratio (8:1 and beyond) on wafer level with industrial quality standard. In addition, the system needs to be equipped to deposit highly textured, uniform and stress-f…
Award criteria
- Price — The comparison was not available.
Awards
| Awarded to | Amount | Date |
|---|---|---|
| Evatec Europe GmbH | — | — |
Official publications
- TED · 00737636-2025 · 6 November 2025
- OJS · 214/2025 · 6 November 2025
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- The contracting authority is TEKNOLOGIAN TUTKIMUSKESKUS VTT OY (European Union).
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