UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
Buyer: UK Research & Innovation
- Published
- 15 February 2024
- Place of performance
- UKJ14
- Procedure
- Open procedure
- Lots
- 1
- Notice number
- 005139-2024
- Reference
- ocds-h6vhtk-0422ea
- Official source
- Official source
Description
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
Official publications
- FTS · 005139-2024 · 15 February 2024
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- The contracting authority is UK Research & Innovation (United Kingdom).
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