Supply, Delivery and Installation Sinter Bonding Capability
Reference ocds-h6vhtk-05cfa9 · University of Strathclyde
Prior notice.
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Amounts and figures
Description
National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.
Official publications
| Medium | Reference | Date |
|---|---|---|
| FTS | 066666-2025 | 20 October 2025 |
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