Supply, Delivery and Installation of Sinter Bonding Capability

Published

17 December 2025

Submission deadline

26 January 2026

Estimated value

£900,000

Place of performance

UKM82

Procedure

Open procedure

Lots

1

Notice number

083991-2025

Reference

ocds-h6vhtk-05f82e

Official source

Official source

Description

National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.

Official publications

• FTS · 083991-2025 · 17 December 2025

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Frequently asked questions

What is the deadline to bid for this tender?

The submission deadline is 26 January 2026. Check the official source, as dates can be modified.

What is the estimated value of this tender?

The estimated value published by the buyer is £900,000.

Who is the buyer of this tender?

The contracting authority is University of Strathclyde (United Kingdom).

How can I bid for public tenders in the United Kingdom?

Bids are submitted through the official public procurement portal in the United Kingdom. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.