Supply, Delivery and Installation of Optical Alignment & Packaging System
Buyer: University of Strathclyde
- Published
- 3 August 2026
- Submission deadline
- 4 September 2026
- Place of performance
- UKM82
- Procedure
- Open procedure
- Lots
- 1
- Notice number
- 073040-2026
- Reference
- ocds-h6vhtk-06d9a6
- Official source
- Official source
Description
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for optical alignment and packaging system to perform various active and passive alignment functions for photonics packaging applications.
Official publications
- FTS · 073040-2026 · 3 August 2026
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Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 4 September 2026. Check the official source, as dates can be modified.
- Who is the buyer of this tender?
- The contracting authority is University of Strathclyde (United Kingdom).
- How can I bid for public tenders in the United Kingdom?
- Bids are submitted through the official public procurement portal in the United Kingdom. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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