Sub-Micron Die Bonder
Buyer: UNIVERSITY OF SHEFFIELD
- Published
- 9 December 2025
- Place of performance
- UKE32
- Lots
- 1
- Notice number
- 081169-2025
- Reference
- ocds-h6vhtk-05f213
- Official source
- Official source
CPV codes
- 38000000Laboratory, optical and precision equipments (excl. glasses)
Description
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.
Official publications
- FTS · 081169-2025 · 9 December 2025
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Frequently asked questions
- Who is the buyer of this tender?
- The contracting authority is UNIVERSITY OF SHEFFIELD (United Kingdom).
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