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Awarded United Kingdom Supplies

NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.

Buyer: University of Strathclyde

Published
3 July 2024
Estimated value
£1,963,564
Place of performance
UKM82
Procedure
Open procedure
Lots
1
Notice number
020273-2024
Reference
ocds-h6vhtk-03f66f
Official source
Official source

CPV codes

Description

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.

Awards

Awarded toAmountDate
Accelonix — —

Official publications

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Frequently asked questions

What is the estimated value of this tender?
The estimated value published by the buyer is £1,963,564.
Who is the buyer of this tender?
The contracting authority is University of Strathclyde (United Kingdom).
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Data collected from official public procurement sources. Amounts as published by the buyer.