NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
Buyer: University of Strathclyde
- Published
- 3 July 2024
- Estimated value
- £1,963,564
- Place of performance
- UKM82
- Procedure
- Open procedure
- Lots
- 1
- Notice number
- 020273-2024
- Reference
- ocds-h6vhtk-03f66f
- Official source
- Official source
CPV codes
- 31710000Electronic equipment
Description
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
Awards
| Awarded to | Amount | Date |
|---|---|---|
| Accelonix | — | — |
Official publications
- FTS · 020273-2024 · 3 July 2024
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Frequently asked questions
- What is the estimated value of this tender?
- The estimated value published by the buyer is £1,963,564.
- Who is the buyer of this tender?
- The contracting authority is University of Strathclyde (United Kingdom).
- How can I bid for public tenders in the United Kingdom?
- Bids are submitted through the official public procurement portal in the United Kingdom. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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