El Vínculo El Vínculo.
Closed European Union ServicesFramework agreement

Wartung/Support für Modellierungssoftware

Buyer: IHP GmbH - Leibniz-Institut für innovative Mikroelektronik

Published
1 April 2025
Submission deadline
28 April 2025, 12:00
Place of performance
Frankfurt (Oder), DE403
Procedure
Open procedure
Lots
1
Documents
1
Notice number
00206766-2025
Reference
d29f6758-15f8-4cf9-b5a3-e03ebb65c884
Official source
Official source

CPV codes

Description

Startkonfiguration laut Pos. 1 bis Pos. 7, Jährliche Zahlung W7300B PathWave IC-CAP Device modeling platform bundle software license Plus W7014E PathWave IC-CAP Wafer Professional (WaferPro) Add-on software license W7311B PathWave IC-CAP Wafer Professional Measurement bundled software license W7021E PathWave IC-CAP PSP Model extraction package license W7026E PathWave IC-CAP HiSIM_HV Model extraction package license W7001E PathWave IC-CAP Core Environment software license W7010E PathWave IC-CAP Simulation and analysis software license Plus Pool fees 2025 Pool fees 2026 Pool fees 2027

Award criteria

Official publications

Other tenders from IHP GmbH - Leibniz-Institut für innovative Mikroelektronik

Frequently asked questions

What is the deadline to bid for this tender?
The submission deadline is 28 April 2025, 12:00. Check the official source, as dates can be modified.
Who is the buyer of this tender?
The contracting authority is IHP GmbH - Leibniz-Institut für innovative Mikroelektronik (European Union).
How can I bid for public tenders in European Union?
Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
Get alerts for tenders like this
Create a free account and receive new tenders from European Union matching your business, every day.

Start for free

Data collected from official public procurement sources. Amounts as published by the buyer.