Wartung/Support für Modellierungssoftware
Buyer: IHP GmbH - Leibniz-Institut für innovative Mikroelektronik
- Published
- 1 April 2025
- Submission deadline
- 28 April 2025, 12:00
- Place of performance
- Frankfurt (Oder), DE403
- Procedure
- Open procedure
- Lots
- 1
- Documents
- 1
- Notice number
- 00206766-2025
- Reference
- d29f6758-15f8-4cf9-b5a3-e03ebb65c884
- Official source
- Official source
CPV codes
- 73000000Servicios de investigación y desarrollo y servicios de consultoría conexos
Description
Startkonfiguration laut Pos. 1 bis Pos. 7, Jährliche Zahlung W7300B PathWave IC-CAP Device modeling platform bundle software license Plus W7014E PathWave IC-CAP Wafer Professional (WaferPro) Add-on software license W7311B PathWave IC-CAP Wafer Professional Measurement bundled software license W7021E PathWave IC-CAP PSP Model extraction package license W7026E PathWave IC-CAP HiSIM_HV Model extraction package license W7001E PathWave IC-CAP Core Environment software license W7010E PathWave IC-CAP Simulation and analysis software license Plus Pool fees 2025 Pool fees 2026 Pool fees 2027
Award criteria
- Price — Preiskriterium für "Niedrigster Preis (ohne Kriterien)"
Official publications
- TED · 00206766-2025 · 1 April 2025
- OJS · 64/2025 · 1 April 2025
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Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 28 April 2025, 12:00. Check the official source, as dates can be modified.
- Who is the buyer of this tender?
- The contracting authority is IHP GmbH - Leibniz-Institut für innovative Mikroelektronik (European Union).
- How can I bid for public tenders in European Union?
- Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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