Wafer Level Reliability Tool
Buyer: Technische Universiteit Eindhoven
- Published
- 7 September 2026
- Submission deadline
- 20 October 2026, 14:00
- Place of performance
- NL414
- Procedure
- Open procedure
- Lots
- 1
- Documents
- 1
- Notice number
- 00615924-2026
- Reference
- f866cd66-ace5-4f4b-922e-11fb712b02db
- Official source
- Official source
CPV codes
- 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)
Description
The delivery and installation of a Wafer Level Reliability Tool 1
Award criteria
- Price — See paragraph 5.2 of the Request for Proposal on page 15 how the score on Price (AC1) will be calulated.
- Quality — The quality (AC2) will be assessed in relation to the whishes mentioned in paragraphs 5.3 and 5.4 (Quality - AC2) of the Request for Proposal (see pages 16, 17 and 18).
Official publications
- TED · 00615924-2026 · 7 September 2026
- OJS · 172/2026 · 7 September 2026
Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 20 October 2026, 14:00. Check the official source, as dates can be modified.
- Who is the buyer of this tender?
- The contracting authority is Technische Universiteit Eindhoven (European Union).
- How can I bid for public tenders in European Union?
- Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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