Wafer Bonder-Aligner
Buyer: Kungliga Tekniska högskolan
- Published
- 20 January 2026
- Estimated value
- 10,000,000 kr
- Place of performance
- Stockholm, SE110
- Procedure
- open
- Lots
- 1
- Notice number
- 00040016-2026
- Reference
- b0232872-ca4a-4567-a5df-37e16c237fb3
- Official source
- Official source
CPV codes
- 33000000Equipamiento y artículos médicos, farmacéuticos y de higiene personal
Description
KTH need this system for Aligned semiconductor wafer bonding, which is a manufacturing process that is critical for future nanoelectronics, photonics, microwave systems, sensors, microelectromechanical systems (MEMS), and quantum systems.
Awards
| Awarded to | Amount | Date |
|---|---|---|
| EV Group | €1,140,000 | — |
Frequently asked questions
- What is the estimated value of this tender?
- The estimated value published by the buyer is 10,000,000 kr.
- Who is the buyer of this tender?
- The contracting authority is Kungliga Tekniska högskolan (European Union).
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