El Vínculo El Vínculo.
Closed European Union Supplies

Wafer Bonder-Aligner

Buyer: Kungliga Tekniska högskolan

Published
21 October 2025
Submission deadline
27 November 2025, 22:59
Estimated value
10,000,000 kr
Place of performance
Stockholm, SE110
Procedure
Open procedure
Lots
1
Documents
1
Notice number
00691141-2025
Reference
b0232872-ca4a-4567-a5df-37e16c237fb3
Official source
Official source

CPV codes

Description

KTH need this system for Aligned semiconductor wafer bonding, which is a manufacturing process that is critical for future nanoelectronics, photonics, microwave systems, sensors, microelectromechanical systems (MEMS), and quantum systems.

Official publications

Other tenders from Kungliga Tekniska högskolan

See all →

Frequently asked questions

What is the deadline to bid for this tender?
The submission deadline is 27 November 2025, 22:59. Check the official source, as dates can be modified.
What is the estimated value of this tender?
The estimated value published by the buyer is 10,000,000 kr.
Who is the buyer of this tender?
The contracting authority is Kungliga Tekniska högskolan (European Union).
How can I bid for public tenders in European Union?
Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
Get alerts for tenders like this
Create a free account and receive new tenders from European Union matching your business, every day.

Start for free

Data collected from official public procurement sources. Amounts as published by the buyer.