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Wafer Bonder

Buyer: Friedrich-Schiller-Universität Jena

Published
25 November 2024
Submission deadline
9 January 2025, 10:00
Estimated value
€375,000
Place of performance
DEG03
Procedure
Open procedure
Lots
1
Documents
1
Notice number
00718854-2024
Reference
6f1118fe-faf3-4667-8913-05da51e12fb3
Official source
Official source

CPV codes

Description

Die Friedrich-Schiller-Universität Jena beabsichtigt, für Forschungszwecke einen (1) vielseiti-gen und benutzerfreundlichen Wafer Bonder anzuschaffen, welcher in Kombination mit Io-nenstrahlimplantation (am Standort vorhanden) die Herstellung von einkristallinen Dünn-schichten über Exfoliation auf verschiedenen Zielsubstraten mit höchster Flexibilität hinsichtlich der verwendbaren Materialien und zugänglichen Bonding-Prozesse ermöglicht und die technischen Leistungsparameter aus Anlage 2 mindestens erfüllen muss. Es stehen insgesamt maximal Mittel in Höhe von 377.300,00 € netto exklusive der Kosten zur Einbringung an die Verwendungsstelle zur Verfügung.

Official publications

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Frequently asked questions

What is the deadline to bid for this tender?
The submission deadline is 9 January 2025, 10:00. Check the official source, as dates can be modified.
What is the estimated value of this tender?
The estimated value published by the buyer is €375,000.
Who is the buyer of this tender?
The contracting authority is Friedrich-Schiller-Universität Jena (European Union).
How can I bid for public tenders in European Union?
Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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Data collected from official public procurement sources. Amounts as published by the buyer.