Low temperatur ICB wafer bonder (ISIT03.1) - PR879696-2390-P

Published

27 March 2025

Place of performance

Itzehoe, DEF0E

Procedure

Negotiated procedure

Lots

1

Notice number

00197865-2025

Reference

6f652553-a96b-4092-a180-16618ad8efb6

Official source

Official source

CPV codes

• 42990000Máquinas diversas para usos especiales

Description

Low temperatur ICB wafer bonder

Award criteria

• Quality — Technische Ausführung
• Price — Preis

Awards

Official publications

• TED · 00197865-2025 · 27 March 2025
• OJS · 61/2025 · 27 March 2025

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Frequently asked questions

Who is the buyer of this tender?

The contracting authority is Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. - Einkauf B12 - Vergabestelle Bau (European Union).

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