Laser Based dicing Tool
Buyer: IMEC VZW
- Published
- 27 November 2024
- Procedure
- Negotiated procedure
- Lots
- 1
- Notice number
- 00724373-2024
- Reference
- 659bbf3c-c72b-42e3-a8d2-f520a462d1b1
- Official source
- Official source
CPV codes
- 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)
Description
The object is the supply and commissioning of equipment for the research and development of industrial scalability of various nanotechnological applications, more specifically a wafer singulation (dicing) tool (hereinafter referred to as: “the Tool”). The tool is designed to be able to singulate wafers by means of a laser-based technique and to edge trim by applying circular cuts. The wafers to be processed consist of copper, LowK or other metal or dielectic films.
Award criteria
- Price — Zie aanbestedings documenten
Awards
| Awarded to | Amount | Date |
|---|---|---|
| DISCO HI-TECH EUROPE GmbH | €1,640,000 | — |
Official publications
- TED · 00724373-2024 · 27 November 2024
- OJS · 231/2024 · 27 November 2024
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Frequently asked questions
- Who is the buyer of this tender?
- The contracting authority is IMEC VZW (European Union).
- How can I bid for public tenders in European Union?
- Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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