Who is the buyer of this tender?

The contracting authority is IMEC VZW (European Union).

Closed European Union

Laser Based dicing Tool

Buyer: IMEC VZW

Open in El Vínculo

Published: 15 January 2024
Procedure: neg-w-call
Lots: 1
Notice number: 00025771-2024
Reference: 659bbf3c-c72b-42e3-a8d2-f520a462d1b1
Official source: Official source

CPV codes

38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)

Description

The object is the supply and commissioning of equipment for the research and development of industrial scalability of various nanotechnological applications, more specifically a wafer singulation (dicing) tool (hereinafter referred to as: “the Tool”). The tool is designed to be able to singulate wafers by means of a laser-based technique and to edge trim by applying circular cuts. The wafers to be processed consist of copper, LowK or other metal or dielectic films.

Frequently asked questions

Who is the buyer of this tender?: The contracting authority is IMEC VZW (European Union).

Get alerts for tenders like this
Create a free account and receive new tenders from European Union matching your business, every day.

Start for free

Data collected from official public procurement sources. Amounts as published by the buyer.