What is the deadline to bid for this tender?

The submission deadline is 21 April 2026. Check the official source, as dates can be modified.

What is the estimated value of this tender?

The estimated value published by the buyer is €1.

Who is the buyer of this tender?

The contracting authority is Silicon Austria Labs GmbH (European Union).

Closed European Union

Hybrid Wafer Bonding

Buyer: Silicon Austria Labs GmbH

Open in El Vínculo

Published: 20 March 2026
Submission deadline: 21 April 2026
Estimated value: €1
Procedure: neg-w-call
Lots: 1
Notice number: 00194187-2026
Reference: 3dd875c3-81d5-4f3e-9e38-8b762df7d082
Official source: Official source

CPV codes

38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)

Description

Ziel dieses Vergabeverfahrens ist es, den im Rahmen des Verfahrens zu ermittelnden Bestbieter für die Lieferung, Installation, Inbetriebnahme sowie die Erbringung von Dienstleistungen für ein Hybrid-Wafer-Bonding-System auszuwählen.

Frequently asked questions

What is the deadline to bid for this tender?: The submission deadline is 21 April 2026. Check the official source, as dates can be modified.
What is the estimated value of this tender?: The estimated value published by the buyer is €1.
Who is the buyer of this tender?: The contracting authority is Silicon Austria Labs GmbH (European Union).

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Data collected from official public procurement sources. Amounts as published by the buyer.