Hybrid Wafer Bonding
Closed. Submission deadline: 21 April 2026.
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Amounts and figures
Description
Ziel dieses Vergabeverfahrens ist es, den im Rahmen des Verfahrens zu ermittelnden Bestbieter für die Lieferung, Installation, Inbetriebnahme sowie die Erbringung von Dienstleistungen für ein Hybrid-Wafer-Bonding-System auszuwählen.
Official publications
| Medium | Reference | Date |
|---|---|---|
| TED | 00194187-2026 | 20 March 2026 |
| OJS | 56/2026 | 20 March 2026 |
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Previous and next from Silicon Austria Labs GmbH
- Silicon Austria Labs – Automated Spectroscopic Ellipsometer
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Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 21 April 2026, 10:00. Check the official source, as dates can be modified.
- What is the estimated value of this tender?
- The estimated value published by the buyer is €1.
- Who is the buyer of this tender?
- The contracting authority is Silicon Austria Labs GmbH (European Union).
- How can I bid for public tenders in the European Union?
- Bids are submitted through the official public procurement portal in the European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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