High Precision bonder for wafer and chiplet level assembly (IZM-01 - PR915599-2590-P
Buyer: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. - Einkauf B12 - Vergabestelle Bau
- Published
- 10 April 2025
- Submission deadline
- 12 May 2025, 08:30
- Place of performance
- Berlin, DE300
- Procedure
- Open procedure
- Documents
- 1
- Notice number
- 00231671-2025
- Reference
- 5f971af6-5323-4926-abfd-1b7963100d28
- Official source
- Official source
CPV codes
- 31712100Maquinaria y aparatos microelectrónicos
Description
High Precision bonder for wafer and chiplet level assembly (IZM-01)
Lots (3)
| Lot | Description | CPV code | Amount |
|---|---|---|---|
| 1 | Los 1: High Accuracy Flip Chip Bonder low force | 31712100 Maquinaria y aparatos microelectrónicos | — |
| 2 | Los 2: High Accuary Flip Chip Bonder | 31712100 Maquinaria y aparatos microelectrónicos | — |
| 3 | Los 3: High Accuracy Flip Chip Bonder high force | 31712100 Maquinaria y aparatos microelectrónicos | — |
Award criteria
- Quality — Technische Ausführung
- Quality — Lieferzeit
- Price — Preis
Official publications
- TED · 00231671-2025 · 10 April 2025
- OJS · 71/2025 · 10 April 2025
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Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 12 May 2025, 08:30. Check the official source, as dates can be modified.
- Who is the buyer of this tender?
- The contracting authority is Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. - Einkauf B12 - Vergabestelle Bau (European Union).
- How can I bid for public tenders in European Union?
- Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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