High accuracy Flip-Chip Bonder - PR463284-2270-W
Buyer: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. - Einkauf B12 - Vergabestelle Bau
- Published
- 2 February 2024
- Submission deadline
- 1 March 2024
- Place of performance
- DE252
- Procedure
- open
- Lots
- 1
- Notice number
- 00071360-2024
- Reference
- 3ce02ed1-d828-4d04-9b43-6e55c2e501e9
- Official source
- Official source
CPV codes
- 42990000Máquinas diversas para usos especiales
Description
High accuracy Flip-Chip Bonder
Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 1 March 2024. Check the official source, as dates can be modified.
- Who is the buyer of this tender?
- The contracting authority is Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. - Einkauf B12 - Vergabestelle Bau (European Union).
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