Fully Automatic Wafer-to Wafer Bonder - PR408678-3460-W
Buyer: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. - Einkauf B12 - Vergabestelle Bau
- Published
- 6 November 2023
- Place of performance
- DED21
- Procedure
- Negotiated procedure
- Lots
- 1
- Documents
- 1
- Notice number
- 00673486-2023
- Reference
- 84e6b744-8a78-4c65-949f-2be1bc835aa2
- Official source
- Official source
CPV codes
- 42990000Máquinas diversas para usos especiales
Description
Fully Automatic Wafer-to Wafer Bonder
Award criteria
- Quality
- Price
Official publications
- TED · 00673486-2023 · 6 November 2023
- OJS · 213/2023 · 6 November 2023
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Frequently asked questions
- Who is the buyer of this tender?
- The contracting authority is Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. - Einkauf B12 - Vergabestelle Bau (European Union).
- How can I bid for public tenders in European Union?
- Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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