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Closed European Union Supplies

Flipchip bonder for assembly of semiconductor components

Buyer: Chalmers Tekniska Högskola Aktiebolag

Published
8 May 2024
Submission deadline
5 June 2024, 21:59
Estimated value
€685,900
Place of performance
SE232
Procedure
Open procedure
Documents
1
Notice number
00271723-2024
Reference
7273d93f-320e-498c-b557-3206d49a1941
Official source
Official source

CPV codes

Description

Flipchip bonder for assembly of semiconductor components.

Lots (2)

LotDescriptionCPV codeAmount
1 General requirements
SE232
38000000 Equipo de laboratorio, óptico y de precisión (excepto gafas) €685,900
2 Tenderer's suitability
SE232
38000000 Equipo de laboratorio, óptico y de precisión (excepto gafas) €685,900

Official publications

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Frequently asked questions

What is the deadline to bid for this tender?
The submission deadline is 5 June 2024, 21:59. Check the official source, as dates can be modified.
What is the estimated value of this tender?
The estimated value published by the buyer is €685,900.
Who is the buyer of this tender?
The contracting authority is Chalmers Tekniska Högskola Aktiebolag (European Union).
How can I bid for public tenders in European Union?
Bids are submitted through the official procurement portal of European Union. El Vínculo helps you find tenders and analyse their documents; submission always happens at the official source.
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Data collected from official public procurement sources. Amounts as published by the buyer.