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Awarded European Union SuppliesEU-funded

FAB FIB SEM

Buyer: Imec EU Pilot line NV

Published
28 October 2025
Place of performance
BE242
Procedure
Negotiated procedure
Lots
1
Notice number
00710774-2025
Reference
4b35577c-1bee-4d20-ba36-c535c61a03b8
Official source
Official source

CPV codes

Description

We are looking for a 300mm wafer ultra-high resolution focused ion beam scanning electron microscope (FIB-SEM) system. The tool should allow for nanometer scale imaging of a cross-section and preparation of precise located and thin TEM lamellae. End-pointing of the cross section as well as location for the TEM lamella needs to be precise within nanometer range on a specific structure. Final achieved thickness of TEM lamella Is required below 30nm to provide minimal overlap within lamella thickness, while still being crystalline and uncontaminated, ready for TEM inspection. The tool needs to be able to load 300mm wafers and have a possibility to load multiple TEM grids on the stage. Grid position needs to allow for lamella preparation in multiple orientations. In-system gas injection for carbon and tungsten deposition is required. In order to increase speed for our current workflow, the tool needs to be able to use automation to perform cross-section analysis and prepare TEM specimen.

Award criteria

Awards

Awarded toAmountDate
FEI EUROPE BV - Branch Belgium €0

Official publications

Other tenders from Imec EU Pilot line NV

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Data collected from official public procurement sources. Amounts as published by the buyer.