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Deposition Tool 8 Inch

Buyer: Lehrstuhl für Technische Physik E23, TUM

This notice is the TED (EU Official Journal) copy of a national announcement.

Published
21 August 2026
Submission deadline
5 October 2026
Place of performance
Garching, DE21H
Procedure
open
Lots
1
Notice number
00579224-2026
Reference
e06c816c-ffcf-4865-9128-954fd6ae4046
Official source
Official source

CPV codes

Description

The Technical University of Munich - Chair of Technical Physics E23/WMI will acquire a UHV cluster System for the fabrication of superconducting circuits on 8 inch'' wafers. The system must provide UHV conditions and has to include an HV load-lock chamber, a central handling chamber, a UHV chamber for the evaporation of Al thin films, a UHV chamber for sputtering of superconductors, a UHV chamber for oxidation, a UHV chamber for Ar ion milling, and a flipping station. The system must allow metalizing both sides of the wafers in situ, with minimal backside particle contamination. The wafers should only be touched on the side (edge gripping).

Frequently asked questions

What is the deadline to bid for this tender?
The submission deadline is 5 October 2026. Check the official source, as dates can be modified.
Who is the buyer of this tender?
The contracting authority is Lehrstuhl für Technische Physik E23, TUM (European Union).
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Data collected from official public procurement sources. Amounts as published by the buyer.