Deposition Tool 8 Inch
Buyer: Lehrstuhl für Technische Physik E23, TUM
- Published
- 21 August 2026
- Submission deadline
- 5 October 2026
- Place of performance
- Garching, DE21H
- Procedure
- open
- Lots
- 1
- Notice number
- 00579224-2026
- Reference
- e06c816c-ffcf-4865-9128-954fd6ae4046
- Official source
- Official source
CPV codes
- 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)
- 42900000Máquinas diversas para usos generales y especiales
Description
The Technical University of Munich - Chair of Technical Physics E23/WMI will acquire a UHV cluster System for the fabrication of superconducting circuits on 8 inch'' wafers. The system must provide UHV conditions and has to include an HV load-lock chamber, a central handling chamber, a UHV chamber for the evaporation of Al thin films, a UHV chamber for sputtering of superconductors, a UHV chamber for oxidation, a UHV chamber for Ar ion milling, and a flipping station. The system must allow metalizing both sides of the wafers in situ, with minimal backside particle contamination. The wafers should only be touched on the side (edge gripping).
Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 5 October 2026. Check the official source, as dates can be modified.
- Who is the buyer of this tender?
- The contracting authority is Lehrstuhl für Technische Physik E23, TUM (European Union).
Get alerts for tenders like this
Create a free account and receive new tenders from European Union matching your business, every day.
Create a free account and receive new tenders from European Union matching your business, every day.