Chip to Wafer Bonder
Buyer: IHP GmbH - Leibniz-Institut für innovative Mikroelektronik
- Published
- 19 January 2024
- Submission deadline
- 20 February 2024
- Place of performance
- Frankfurt (Oder), DE403
- Procedure
- open
- Lots
- 1
- Notice number
- 00040215-2024
- Reference
- cc18f471-e267-403b-9a30-6076bb53cd07
- Official source
- Official source
CPV codes
- 38000000Equipo de laboratorio, óptico y de precisión (excepto gafas)
Description
Dyson V15s Detect SubmarineTM Nass- und Trockensauger
Frequently asked questions
- What is the deadline to bid for this tender?
- The submission deadline is 20 February 2024. Check the official source, as dates can be modified.
- Who is the buyer of this tender?
- The contracting authority is IHP GmbH - Leibniz-Institut für innovative Mikroelektronik (European Union).
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